In support of demand for millimeter-wave devices and surface-mount (SMT) packages, KCB Solutions has expanded its RF design, manufacturing and test capabilities to 50 GHz, leveraging expertise in packaging technology for high reliability applications.

Packaging Solutions

KCB Solutions has developed proprietary transitions for hermetic and low-cost non-hermetic packages that deliver outstanding performance.

KCB Solutions is able to provide back-end services for companies wishing to deploy off-the-shelf die as well as custom designed devices. KCB Solutions provides a vehicle to implement a variety of functional blocks in a surface mount environment for both low-cost and hi-rel components.

Screening Solutions

KCB Solutions has developed proprietary transitions for hermetic and low-cost non-hermetic packages that deliver outstanding performance.

Capabilities include:

➢ Device evaluation & qualification
Element Evaluation; Wafer Lot Acceptance

➢ Device manufacturing
Eutectic/Epoxy die bond; Wedge and ball bonding; Visual/bond pull inspection; Ink or engrave marking; Hermetic solder & seam seal; Package lead forming

➢ Device testing and screening
Small & Large signal RF (DC to 20 GHz); DC parameters; Custom ATE development; MIL-STD-750; MIL-STD-883; MIL-STD-19500; MIL-PRF-38534; MIL-PRF-38535

Case Study

KCB reverse engineered an obsolete SP4T switch with SPST and SPDT die and a rad-hardened CMOS driver. The module was screened to Space Level Class K, hermetically sealed, and delivered on-time at a competitive price.