SemiGen is vastly experienced in the manufacturing of RF, microwave, and millimeter-wave circuits and assemblies, with particular expertise in mixed RF/digital assembly-including microcontrollers.  SemiGen assemblers are experts in eutectic attachment, advanced thermo compression, ultrasonic wire or ribbon, ball bonding, and hand-assembly techniques. For precision assembly, our automatic bonding and die attach equipment is trusted by leading brands when component position, loop height, and spacing are critical to performance.

SemiGen provides turnkey electrical and quality testing in-house with circuit tuning capability.  SemiGen also offers complete semiconductor up-screening to Class H, Class K, MIL-PRF-38534, MID-STD-750, JAN, JANTX, and JANTXV specifications.

SemiGen offers custom laser-cut epoxy preforms, epoxies, pastes and the most often used wire bonding tools and materials.